SANTA CLARA, Calif.--(BUSINESS WIRE)--Dec. 6, 2005--Applied Materials, Inc. today announced the Applied Centura(R) AdvantEdge(TM) Metal Etch, the most advanced system ...
SANTA CLARA, Calif.--(BUSINESS WIRE)--March 29, 2001--Applied Materials, Inc. today introduced the Silicon Etch DPS(TM) II Centura(R) 300 and Metal Etch DPS(TM) II Centura(R) 300 systems, a ...
Applied Materials today rolled out its DPS II Centura 300 etch tool, its second-generation 300mm tool featuring a chamber that can be used for either silicon or metal etch, the Santa Clara, ...
Chipmakers’ focus on new interconnect technology is ramping up as copper’s effectiveness continues to diminish, setting the stage for a significant shift that could improve performance and reduce heat ...
Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...
Over the past few decades, polydimethylsiloxane (PDMS) has become the material of choice for a variety of microsystem applications, including microfluidics, imprint lithography, and soft microrobotics ...
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