SAN DIEGO — In a move to compete against extreme ultraviolet (EUV) technology for next-generation lithography applications, JMAR Technologies Inc. today announced plans to acquire Semiconductor ...
MELVILLE, N.Y., July 7, 2020 /PRNewswire/ -- Canon U.S.A., Inc. today announced that its parent company, Canon Inc., expects to commence sales in early July 2020 of the FPA-8000iW i-line stepper1, a ...
SAN JOSE — Ultratech Stepper Inc. today rolled out a new exposure tool, called the Star 100, which is aimed at serving lithography process steps with device feature sizes above 0.8 micron. The new ...
TOKYO--(BUSINESS WIRE)--USHIO INC. (TOKYO:6925) (President and CEO: Shiro Sugata) today announced that at SEMICON West 2014 (Booth #2105) the company will exhibit a series of its lithography tools for ...
MELVILLE, N.Y., April 8, 2021 /PRNewswire/ -- Canon U.S.A., Inc., a leader in digital imaging solutions, today announced that its parent company, Canon Inc., has launched the FPA-5520iV LF Option for ...
The two Japanese tech giants, Nikon and Canon, are making waves in the semiconductor machinery sector. After a quarter-century hiatus, Nikon reenters the market with an i-line stepper based on old ...
Shenzhen-based Wonder Sight has launched its first domestically developed high-precision stepper lithography machine, a milestone in China's semiconductor equipment sector. Some subscribers prefer to ...
Fan-out wafer level packaging (FOWLP) is a popular new packaging technology that allows the user to increase I/O in a smaller IC size than fan-in wafer level packaging. Market drivers such as 5G, IoT, ...
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