Abstract: The Sn-0.7Cu-0.05Ni solder composition was first introduced in 1999 as a Pb-free interconnection material for the electronics industry and quickly earned widespread popularity as a ...
Abstract: Low temperature bonding of wafers with thin nanocrystalline metal film was a critical method on wafer-to-wafer bonding. This paper had finished the thin nanocrystalline Cu films wafer level ...
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