SAN JOSE — Ultratech Stepper Inc. today rolled out a new exposure tool, called the Star 100, which is aimed at serving lithography process steps with device feature sizes above 0.8 micron. The new ...

TOKYO--(BUSINESS WIRE)--USHIO INC. (TOKYO:6925) (President and CEO: Shiro Sugata) today announced that at SEMICON West 2014 (Booth #2105) the company will exhibit a series of its lithography tools for ...

As the promise of EUV (extreme-ultraviolet) lithography fades, the old war-horse, 193 nm, is again rising up to fill the gap. By immersing the wafer and the front element of the lens in water, stepper ...

Shenzhen-based Wonder Sight has launched its first domestically developed high-precision stepper lithography machine, a milestone in China's semiconductor equipment sector. Some subscribers prefer to ...

The More than Moore era is upon us, as manufacturers increasingly turn to back-end advances to meet the next-generation device performance gains of today and tomorrow. In the advanced packaging space, ...

MELVILLE, N.Y., April 8, 2021 /PRNewswire/ -- Canon U.S.A., Inc., a leader in digital imaging solutions, today announced that its parent company, Canon Inc., has launched the FPA-5520iV LF Option for ...

Fan-out wafer level packaging (FOWLP) is a popular new packaging technology that allows the user to increase I/O in a smaller IC size than fan-in wafer level packaging. Market drivers such as 5G, IoT, ...

LONDON--(BUSINESS WIRE)--According to the latest research study released by Technavio, the global semiconductor stepper system market is expected to reach over USD 6 billion by 2020. This research ...